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Development of special assembly procedures
Sawing of wafers, photolithographic masks and special materials
> Materials: Silicon, Glass, Quartz, Lithiumtantalate, Lithiumniobate etc.
> Dimensions up to 6“
Surface cleaning and activation by plasma treatment
> Process gas: O2, N2, Ar, He, also mixtures possible
> 40kHz plasma generator
Placement onto packages and other base materials
> Operating range 400x200mm²
> Feeding of SMD
> Feeding of dies from up to 8" wafers
> Dispensing
> Taping after processing possible
Seam welding
> Welding of parts with edge length from 2mm to 50mm
> Leakage down to 10-9 mbar*l/s
> Sealing under protective gas atmosphere (N2/He mixture)
Projection welding
> Welding of parts by projection welding process
> Sealing with leak rate down to 10-9 mbar*l/s
> Parts with edge length up to 36mm (perimeter up to 144mm), also
. .round parts (perimeter up to 144mm)
> Sealing under protective gas atmosphere, mixtures of 3 different gases possible
> Dehydrogenation prior to welding
Fine leak test
> Testing your devices with helium test equipment by Bombing Process
Laser processing
> For parts of approximately 300mmx300mmx200mm
> 20W fiber laser
> Positioning and laser accuracy down to 25µm
> All kinds of marking
> Cutting of parts up to 500µm thickness
